Light source module, fabrication method therefor, and lighting device including the same

ABSTRACT

A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefits of priority to Korean PatentApplication No. 10-2015-0178666 filed on 14 Dec. 2015, and10-2015-0096032 filed on 6 Jul. 2015, which are herein incorporated byreference in their entirety.

BACKGROUND

The present disclosure relates to a light source module, a fabricationmethod therefor, and a lighting device including the same.

In general, incandescent bulbs or fluorescent lamps are frequently usedas indoor or outdoor lighting devices. However, the lifespan of theincandescent bulbs or the fluorescent lamps is short, and therefore, itis necessary to frequently replace the incandescent bulbs or thefluorescent lamps with new ones. The fluorescent lamps can be used for along period of time as compared with the incandescent bulbs, but areharmful to the environment. In addition, the fluorescent lamps aredeteriorated over time, and therefore, the illumination intensity of thefluorescent lamps is gradually reduced.

In order to solve these problems, there has been proposed a lightemitting diode (LED) capable of exhibiting excellent controllability,rapid response speed, high electric/light conversion efficiency, longlifespan, low power consumption, high luminance, and emotional lighting.Also, there have been developed various types of lighting modules andlighting devices employing the LED.

The LED is a semiconductor device that coverts electric energy intolight. The LED has advantages of low power consumption, semi-permanentlifespan, rapid response speed, safety, and environmental friendlyproperties as compared with existing light sources such as fluorescentlamps and incandescent bulbs. For these reasons, much research has beenconducted to replace the existing light sources with the LED.Furthermore, the LED has been increasingly used as light sources oflighting devices, such as various liquid crystal displays, electricbulletin boards, and streetlights, which are used indoors and outdoors.

A light emitting device (hereinafter, the light emitting device ismainly referred to as an LED, but the present disclosure is not limitedthereto) is fabricated in the form of a light source module forimproving assembly convenience and protecting the light emitting devicefrom external impact and moisture. In the light source module, aplurality of light emitting devices is integrated with high density, andhence higher luminance can be realized.

Korean Patent Registration No. 10-1472403 filed and registered by thepresent applicant shows a conventional light source module.

The light source module according to the prior art is fabricated bycoupling, to a heat sink, a printed circuit board having a plurality oflight emitting devices mounted thereon.

SUMMARY

It is an object of the invention to provide a light source module, afabrication method therefor, and lighting device including the same withreduced manufacturing efforts and costs. This object is achieved withthe features of the claims.

A preferred technical effect or advantage of the light source module isto prevent malfunction caused by a foreign substance or water droppenetrating from the outside and to prevent a conductive material frombeing oxidized due to contact with air.

A preferred technical effect or advantage of the light source module isthat a loss of a portion of light emitted from a light source isavoided.

A preferred technical effect or advantage of the light source module isto avoid that heat generated from the light source is not diffused tothe entire heat sink.

A preferred technical effect or advantage of the fabrication method fora light source module to solve a problem in that fabrication time andfabrication cost are excessively required due to a plurality offabrication processes caused by coupling a printed circuit board to aheat sink and inserting a thermal pad between the printed circuit boardand the heat sink.

In one embodiment, there is provided a light source module wherein aconductive layer includes a light source region in which at least onelight source is placed and connection regions through which electriccurrent is supplied to the light source, and a protective layer isstacked in the connection region. Such structure allows for a rapidfabrication processes, inexpensive fabrication cost, facilitation ofmass production, and improvement of product yield.

The light source module may comprise a heat sink supporting the lightsource on a top surface thereof, the heat sink absorbing heat from thelight source and dissipating the heat to the outside.

The light source module may comprise an insulating layer provided on atleast one surface of the heat sink, the insulating layer havingelectrical insulating properties. The conductive layer may be providedon the insulating layer.

The light source module may comprise connection regions and the lightsource region being disposed between the connection regions, the lightsource region having the light source mounted therein.

The light source module may further include a bonding layer.

The protective layer may be provided in a region except the conductivelayer on which the bonding layer is provided. In other words, theprotective layer may be provided on the insulating layer or theconductive layer.

The protective layer may be provided on the insulating layer and aportion of the conductive layer except the light source region. Also,the protective layer may be provided in only the connection region.

The protective layer may protect the conductive layer from the bondinglayer. Specifically, the protective layer may be provided such that onlythe light source region is opened.

The protective layer may include a reflective material. Accordingly, theprotective layer reflects light emitted from the light source, therebyimproving the efficiency of the light.

The light source region may comprise a light source mounting partproviding a positive electric current and negative electric current tothe light source.

The conductive layer may further include a heat dissipation region fortransferring heat generated from the light source to the heat sink.

The heat dissipation region may comprise an inner heat dissipationregion provided inside the light source region and the connectionregion; an outer heat dissipation region provided outside the lightsource region and the connection region; and a bridge connecting theinner heat dissipation region and the outer heat dissipation region toeach other.

The protective layer may be stacked in the heat dissipation region.

The protective layer may further be stacked on the insulating layer.

The heat sink may further comprise a heat dissipation fin provided on abottom surface of the heat sink, the heat dissipation fin dissipatingheat to the outside; and an air hole passing through the heat sink.

In another embodiment, a method for fabricating a light source moduleincludes: providing a heat sink; applying an insulating layer on atleast one surface of the heat sink; providing a recess part having ametal junction face in the insulating layer; providing a conductivelayer in the recess part; applying a protective layer on the conductivelayer; and bonding a light source to the conductive layer. Such methodallows for a rapid fabrication, inexpensive fabrication cost,facilitation of mass production, and improvement of product yield.

The light source module according to the present disclosure is used inlight emitting devices, thereby obtaining much more advantages inindustries.

The details of one or more embodiments are set forth in the accompanyingdrawings and the description below. Other features will be apparent fromthe description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a light source module according to afirst embodiment.

FIG. 2 is an exploded perspective view of the light source module ofFIG. 1.

FIG. 3 is a front view of the light source module of FIG. 1.

FIG. 4 is a side view of the light source module of FIG. 1.

FIG. 5 is a bottom view of the light source module of FIG. 1.

FIG. 6 is a sectional view taken along line 6-6 of FIG. 1.

FIG. 7 is an enlarged view of a portion at which a light source isplaced in FIG. 1.

FIGS. 8 to 13 are views sequentially illustrating a fabrication methodof the light source module.

FIG. 14 is a plan view of the light source module of FIG. 1.

FIG. 15 is a plan view illustrating a state in which any protectivelayer is not provided in the light source module of FIG. 14.

FIG. 16 is a plan view of a light source module according to a secondembodiment.

FIG. 17 is a plan view illustrating a state in which any protectivelayer is not provided in the light source module of FIG. 16.

FIG. 18 is a perspective view of a lighting device including lightsource modules according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, exemplary embodiments will be described in detail withreference to the accompanying drawings. The technical objective ofembodiments is not limited to the aforementioned technical problem, andtechnical problems not mentioned above can be clearly understood by aperson skilled in the art by the disclosure below.

FIG. 1 is a perspective view of a light source module according to afirst embodiment. FIG. 2 is an exploded perspective view of the lightsource module.

Referring to FIGS. 1 and 2, the light source module 100 according to theembodiment may include at least one light source 11 generating light anda body supporting the light source 11.

The light source 11 may include all means that generate light by beingsupplied with electric energy. For example, the light source 11 mayinclude a light source in the form of a point light source.Specifically, the light source 11 may include any one of a lightemitting diode and a laser diode. In the light source 11, a plurality ofpoint light sources emitting light of different colors may be disposedadjacent to each other such that the colors are mixed with each other,thereby emitting light of white or another color.

The body is provided as a part that allows the light source 11 toperform a physical electrical action, so that the light source 11 can bestably operated. The body enables heat generated from the light source11 to be effectively dissipated. The body is electrically connected tothe light source 11 to supply power to the light source 11.

The body may include a heat sink 120. The light source 11 may befastened to the heat sink 120 through the medium of another member, ormay be directly fastened to the heat sink 120. Preferably, the lightsource 11 may be fastened to the heat sink 120 for the purpose ofphysical coupling such as support of the weight thereof. However, inorder to insulate between the light source 11 and the heat sink 120, thelight source 11 may be fastened to the heat sink 120 with apredetermined insulating layer interposed therebetween.

A mounting part 121 (see FIG. 6) on which the light source 11 is mountedmay be provided on one surface of the heat sink 120. The mounting part121 allows heat generated from the light source 11 to be rapidlyabsorbed into the heat sink 120. When a heat dissipation fin 130 isconnected to the other surface of the heat sink 120, the heat sink 120may transfer, to the heat dissipation fin 130, heat generated from thelight source 11 and heat generated by light emitted from the lightsource 11. It will be apparent that the heat dissipation fin 130 mayrapidly dissipate heat to the outside. The heat sink 120 may rapidlydissipate heat to the outside.

The heat sink 120 may be formed of a metal or resin material havingexcellent heat radiation and heat transfer efficiencies, but the presentdisclosure is not limited thereto. As an example, the heat sink 120 maybe an alloy made of one or two or more selected from the groupconsisting of aluminum (Al), gold (Au), silver (Ag), copper (Cu), nickel(Ni), tin (Sn), zinc (Zn), tungsten (W), and iron (Fe). As anotherexample, the heat sink 120 may be formed of at least one selected fromthe group consisting of a resin material such as polyphthalamide (PPA),silicon (Si), aluminum nitride (AlN), photo sensitive glass (PSG),polyamide9T (PA9T), syndiotactic polystyrene (SPS), a metal material,sapphire (Al₂O₃), beryllium oxide (BeO), and ceramic. The heat sink 120may be formed through injection molding, etching, etc., but the presentdisclosure is not limited thereto.

The heat sink 120 has a plate shape, and may be provided with aquadrangular planar shape. Specifically, the mounting part 121 may beformed by recessing one surface (e.g., an upper surface) of the heatsink 120. A lens cover 142 may be mounted on the mounting part 121. Themounting part 121 may be provided with a waterproof structure with theoutside by the lens cover 142. The light source 11 can be waterproofedby coupling between the mounting part 121 and the lens cover 142.

A fastening hole 126 may be formed at an edge of the heat sink 120. Whenthe light source module 100 is coupled to a lighting device, a fasteningmember passes through the fastening hole 126.

The body may further include the heat dissipation fin 130 and an airhole 122, which improve the heat dissipation efficiency of the heat sink120.

The heat dissipation fin 130 may have a shape in which the area of theheat dissipation fin 130 contacted with air is maximized. The heatdissipation fin 130 is transferred with heat of the heat sink 120 to beheat-exchanged with external air. Specifically, the heat dissipation fin130 may be provided in the shape of a plurality of plates furtherextending downward from the other surface (bottom surface) of the heatsink 120. More specifically, the heat dissipation fin 130 may bedisposed in plurality with a predetermined pitch. In addition, the widthof the heat dissipation fin 130 may be formed in a region in which it isequal to the width of the heat sink 120 such that heat of the heat sink120 can be effectively transferred to the heat dissipation fin 130. Theheat dissipation fin 130 may be formed with the heat sink 120 as asingle body, or may be fabricated as a separate component part. Also,the heat dissipation fin 130 may include a material having excellentheat transfer efficiency, e.g., at least one selected from the groupconsisting of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), andtin (Sn). Preferably, the heat dissipation fin 130 may be integrallyformed with the heat sink 120 using the same material.

FIG. 3 is a front view of the light source module. FIG. 4 is a side viewof the light source module.

Referring to FIGS. 3 and 4, the heat dissipation fin 130 may be disposedlong in the width direction of the heat sink 120. The heat dissipationfin 130 may be disposed in plurality with a predetermined pitch in thelength direction of the heat sink 120. A central portion 131 of the heatdissipation fin 130 may be further depressed toward the heat sink 120than both end portions 133 of the heat dissipation fin 130. Since thelight sources 11 are positioned to vertically overlap with both the endportions 133, respectively, both the end portions 133 of the heatdissipation fin 130 are higher than the central portion 131 of the heatdissipation fin 130, and thus the contact area of the heat dissipationfin 130 can be increased. The central portion 131 of the heatdissipation fin 130 may be formed to save fabrication cost.

The air hole 122 (see FIG. 2) may be formed in the heat sink 120. Theair hole 122 may be formed to vertically pass through the heat sink 120.Specifically, the air hole 122 may be formed to pass through the heatsink 120 toward the head dissipation fin 130 from the mounting part 121.The air hole 122 may provide a space in which air flows. The air hole122 may be formed long in the length direction of the heat sink 120 at acentral portion of the heat sink 120. The air hole 122 may communicatewith a cover hole 143 (see FIGS. 1 and 2) formed in the lens cover 142while vertically overlapping with the cover hole 143.

The light sources 11 may be positioned at the periphery of the air hole122. Specifically, the light sources may be disposed adjacent to the airhole 122 on the one surface of the heat sink 120, which forms theperiphery of the air hole 122. Therefore, the air hole 122 may be firstheated by heat generated from the light sources 11. The air hole 122 mayallow air to be circulated by a temperature difference between theinside and outside of the air hole 122. The circulated air mayaccelerate cooling of the heat dissipation fin 130 and the heat sink120. Specifically, the air hole 122 may be positioned to verticallyoverlap the central portion 131 of the heat dissipation fin 130. Thelight sources 11 may be positioned to respectively overlap both the endportions of the heat dissipation fin 130.

FIG. 5 is a bottom view of the light source module.

Referring to FIG. 5, the light source module 100 may further include anair guiding part 160 extending downward of the heat sink 120 from thecircumference of the air hole 122, the air guiding part 160communicating with the air hole 122 to guide air. (Herein, the term“downward” assumes that the light source is at the top side, and theheat dissipation fins are on the bottom side of the light source module.In general, the air guiding part extends from the side carrying thelight source to the side having the heat dissipation fins, irrespectiveof the final orientation of the light source module). The air guidingpart 160 may be formed in the shape of a cylinder having a spacetherein, and the circumference of the air guiding part 160 may beconfigured to overlap with the circumference of the air hole 122. Thatis, the air guiding part 160 may be formed in the shape of a chimneysurrounding the air hole 122. The section of the air guiding part 160may be formed in the shape of a rectangle, and each corner of therectangle may be curved.

The air guiding part 160 may be made of a material having excellent heattransfer property. For example, the air guiding part 160 may include atleast one selected from the group consisting of aluminum (Al), nickel(Ni), copper (Cu), silver (Ag), and tin (Sn). Also, the air guiding part160 may be formed of at least one selected from the group consisting ofa resin material such as polyphthalamide (PPA), silicon (Si), aluminumnitride (AlN), photo sensitive glass (PSG), polyamide9T (PA9T),syndiotactic polystyrene (SPS), a metal material, sapphire (Al₂O₃),beryllium oxide (BeO), and ceramic.

The outer surface of the air guiding part 160 is connected to at leastportions of a plurality of heat dissipation fins 130, so that heattransferred from the light source 11 to the heat dissipation fin 130 canbe transferred to the air guiding part 160. The air guiding part 160 mayfurther accelerate the air flowing into the air hole 122. In addition, aconnector hole 124 (see FIG. 2) through which a connector 190 supplyingpower to the light source 11 passes may be formed in the heat sink 120.

FIG. 6 is a sectional view taken along line 6-6 of FIG. 1. FIG. 6 is asectional view taken along a portion at which the light sources 11 areplaced, specifically, a portion at which power is applied to the lightsources 11.

Referring to FIG. 6, an electrically insulating layer 20 may be entirelyformed on a surface of the heat sink 120. When the heat dissipation fin130 and the air guiding part 160 is formed with the heat sink 120 as asingle body, the insulating layer 20 may also be formed on surfaces ofthe heat dissipation fin 130 and the air guiding part 160. In this case,the heat sink 120, the heat dissipation fin 130, and the air guidingpart 160 may be provided together by a die-casting technique, and theinsulating layer 20 may be then provided.

The insulating layer 20 may be applied by a powder coating technique.The powder coating technique may be any one of an electrostatic spraytechnique, an electrostatic brush technique, and a fluidized bedtechnique. Therefore, the insulating layer 20 may be referred to as acoated insulating layer. Accordingly, a process can be rapidly andinexpensively performed.

The insulating layer 20 may electrically (but not thermally) insulatebetween the heat sink 120 and a conductive layer 40 which will bedescribed later. The conductive layer 40 has electrical conductivity andhence may be electrically connected to the light source 11. Theconductive layer 40 may be a path through which electric current isapplied to the light source 11. Also, the conductive layer 40 may have afunction of rapidly diffusing heat. To this end, the conductive layer 40may be made of a metal material. The conductive layer 40 may include atleast one selected from the group consisting of Ag, Au, Cu, and Ni.

The light source 11 may be provided as a vertical light emitting diodeincluding two electrodes formed downwardly. If the vertical lightemitting diode is mounted on the conductive layer 40, separate wirebonding is not required.

The conductive layer 40 may be provided in a recess part 21 (see FIG. 9)previously formed at a position at which the conductive layer 40 is tobe provided. The recess part 21 is a region provided by etching theinsulating layer 20 through laser direct structuring (LDS). The recesspart 21 may be formed into a structure in which at least the bottomsurface in its internal region has a rough surface including a metalcore.

The conductive layer 40 may be provided in the recess part 21, tothereby form circuit patterns interconnecting the light sources 11 tothe connector hole 124. The conductive layer 40 may be provided byrepeatedly performing a plating process at least once. According to anembodiment, in the conductive layer 40, Cu and Ni may be sequentiallystacked to respectively provide a first plating layer 41, and a secondplating layer 42, which will be described later. With thisconfiguration, heat generated by the light sources 11 transfers easilythrough the conductive layer 40 and the recess part 21 of the insulatinglayer 20 to reach the heat sink 120.

The method of providing the insulating layer 20, the recess part 21, andthe conductive layer 40 may be performed by forming a conductive film onthe insulating layer through techniques such as sputtering andelectrolytic/electroless plating using a conductive material such ascopper and then etching the conductive film. In this case, the recesspart 21 may be previously provided in the insulating layer 20 so as toprevent a short circuit, etc. However, more preferably, the LDS may beperformed because fabrication cost is inexpensive, a process can berapidly and precisely performed, and mass production can be achievedusing laser equipment.

The light source module 100 may further include a plurality of lenses141 that shield the light sources 11 and refract light generated fromthe light sources 11. The lens 141 may diffuse light generated from thelight source 11. The lens 141 may determine the diffusion angle of lightgenerated from the light source 11 according to its shape. For example,the lens 141 may be molded in a concave shape around the light source11. Specifically, the lens 141 may include a material allowing light tobe transmitted therethrough. For example, the lens 141 may be formed oftransparent silicon, epoxy, or another resin material. In addition, thelens 141 may surround the light source to protect the light source 11from external moisture and impact and to isolate the light source 11from the outside.

More specifically, for convenience of assembly, the lens 141 may beprovided to the lens cover 142 formed corresponding to the insulatinglayer 20. The lens cover 142 may be formed to correspond to theinsulating layer 20 on the top surface of the insulating layer 20. Thelens 141 positioned at the lens cover 142 may be disposed at a positionoverlapping the light source 11. The lens cover 142 may be inserted andmounted into the mounting part 121 to waterproof the light source 11from the outside.

The cover hole 143 communicating with the air hole 122 may be formed inthe lens cover 142. Specifically, the cover hole 143 may be formed tovertically pass through the lens cover 142 at the center of the lenscover 142.

The insulating layer 20 may include a material capable of efficientlyreflecting light. In this case, light emitted from the light source 11and light reflected from the lens cover 142 including the lens 141 areagain reflected to the outside, thereby further improving the useefficiency of light. Further, light lost as heat is reduced, therebyachieving high heat dissipation efficiency.

FIG. 7 is an enlarged view of a portion at which a light source isplaced.

Referring to FIG. 7, a metal junction face 22 may be processed in aninner surface of the recess part 21 (see FIG. 9). In the metal junctionface 22, laser is irradiated onto a plating target region, so that asurface of the insulating layer 20 can be processed as a surface havinga property suitable for plating. The metal junction face 22 may beprovided with a metal core, or may be processed as a lattice-shapedtrench. The metal junction face 22 may include at least the bottomsurface of the recess part 21.

The conductive layer 40 may be stacked on the metal junction face 22. Atleast one plating layer may be stacked in the conductive layer 40. Forexample, the conductive layer 40 may include the first plating layer 41made of copper and the second plating layer 42 made of nickel. The firstplating layer 41 may be stacked to a thickness of 10 to 20 μm, and thesecond plating layer 42 may be stacked to a thickness of 5 to 15 μm. Inaddition, a third plating layer (not shown) made of gold may be stackedto a thickness of 0.1 μm or so on the second plating layer 42. However,the third plating layer (not shown) may cause an increase in materialcost. Therefore, in this embodiment, it will be described that the thirdplating layer (not shown) is not stacked.

The first plating layer 41 placed at the lowermost side of theconductive layer 40 serves as an electroconductive functional layer thatcan reduce the amount of heat generation by reducing electricalresistance. To this end, the first plating layer 41 may be made ofcopper. In order to ensure sufficient electrical conductivity, the firstplating layer 41 may be formed thickest among the plating layers. Thefirst plating layer 41 may be made of a metal having a high electricalconductivity as well as the copper.

The second plating layer 42 placed on the surface of first plating layer41 serves as a soldering functional layer that improves the quality ofsoldering. In order to perform soldering, it is necessary for a meltedsolder to be well wettable on the entire surface of a base material andto be well spread on the surface of the base material. The secondplating layer 42 may be made of nickel as a metal for ensuringcharacteristics of the soldering.

A bonding layer 50 may be provided on the conductive layer 40. The lightsource 11 may be placed on the bonding layer 50. The bonding layer 50may include a low-temperature solder paste with which soldering can beperformed at a low temperature. For example, the bonding layer 50 mayinclude OM525. The bonding layer 50 may be provided by allowing thelow-temperature solder paste to pass through a reflow machine in a statein which a light emitting device is mounted on the low-temperaturesolder paste. The soldering is performed at the low temperature, so thatit is possible to prevent separation between the heat sink 120 and theinsulating layer 20 and separation between the insulating layer 20 andthe conductive layer 40.

A protective layer 60 may be provided on the conductive layer 40. Theprotective layer 60 may be provided in a region except the conductivelayer 40 on which the bonding layer 50 is provided. In other words, theprotective layer 60 may be provided on the insulating layer 20 or theconductive layer 40.

The protective layer 60 can prevent the conductive layer 40 from beingoxidized. Also, the protective layer 60 can prevent a foreign substance,a water drop, or the like from penetrating into the conductive layer 40.Also, the protective layer 60 can protect the conductive layer 40 fromexternal impact.

The protective layer 60 may include an insulating material. For example,the protective layer 60 may include a solder resist, an epoxy material,a nano insulating coating material, a flexible composite insulatingmaterial, an organic material, an insulating permanent coating material,a polycarbonate material, a resin material, etc. However, in thisembodiment, it will be described that the protective layer 60 is asolder resist.

FIGS. 8 to 13 are views sequentially illustrating a fabrication methodof the light source module.

First, referring to FIG. 8, the insulating layer 20 may be provided to abody fabricated by, for example, a die-casting technique. The insulatinglayer 20 may be applied by a powder coating technique. The powdercoating technique may be any one of an electrostatic spray technique, anelectrostatic brush technique, and a fluidized bed technique. Therefore,the insulating layer 20 may be referred to as a coated insulating layer.The thickness of the coated insulating layer may be 60 to 80 μm.However, the thickness is not limited thereto, and may be selected tohave various dimensions according to insulation performance, heatdissipation performance, and process variables. In an embodiment, acondition may be found in which, when the light source 11 is a lightemitting diode and is connected to a commercial power source, theinsulation and heat dissipation of the insulating layer 20 can beensured, and the providing of the insulating layer 20 can be performedthrough an inexpensive process.

The LDS may be applied to the insulating layer 20 such that theconductive layer 40 is plated on at least one portion of the surface ofthe insulating layer 20. The LDS is a process performed before a platingprocess, and refers to a process of irradiating laser onto a platingtarget region of the surface of the insulating layer 20, so that aplating target region of the surface of a resin molded article isreformed to have a property suitable for plating. To this end, theinsulating layer 20 may contain a ‘core generating agent for LDS’(hereinafter, simply referred to as a ‘core generating agent’) capableof forming a metal core by means of laser, or may have a predeterminedpattern formed therein such that a plating layer is provided at theinner surface of the recess part 21.

First, a case where the insulating layer 20 contains a core generatingagent will be described.

A core generating agent may be contained in the resin molded articleproviding the insulating layer 20. If laser is irradiated onto the coregenerating agent, a metal core may be generated as the core generatingagent is decomposed. In addition, the plating target region onto whichthe laser is irradiated may have a surface roughness. The plating targetregion reformed by the laser can be suitable for plating due to themetal core and the surface roughness. The metal core may mean a corewith which a metal is joined in a subsequent plating process.

The core generating agent may include a metal oxide having a spinel, aheavy metal composite oxide spinel such as copper chromium oxide spinel,a copper salt such as copper hydroxide phosphate, copper phosphate,copper sulfate, or cuprous thiocyanate, and the like. A polyester-basedresin may be used as the resin molded article. Since the polyester-basedresin has better adhesion with a metal, it is possible to preventseparation between the heat sink 120 and the insulating layer 20 andseparation between the insulating layer 20 and the conductive layer 40,which may occur in a bonding process of the light source 11 as asubsequent process.

A case where a predetermined pattern is formed in the inner surface ofthe recess part 21 will be described in detail. Although the resinmolded article does not contain the core generating agent, theconductive layer 40 may be provided by forming a trench line with apredetermined pattern arrangement in the plating target region. Theplating process may be performed on the trench line by effectivelypromote the joining of a metal with the plating target region on thesurface of the resin molded article. The trench line may be providedwith at least two kinds of trenches intersecting each other.

The forming of the trench line with the predetermined patternarrangement may be performed by irradiating laser onto the platingtarget region of the surface of the resin molded article.

FIG. 9 is a view illustrating that the recess part is provided in theinsulating layer.

Referring to FIG. 9, laser may be used as a means for providing therecess part 21 in the insulating layer 20. A medium providing the lasermay include, for example, yttrium aluminum garnet (YAG), yttriumorthovanadate (YVO₄), ytterbium (YB), CO₂, etc. The wavelength of thelaser may be, for example, 532 nm, 1064 nm, 1090 nm, 9.3 μm, 10.6 μm,etc. An algorithm in which processing is performed by recognizing athree-dimensional (3D) shape may be used when the processing isperformed using the laser. For example, a method may be applied in whichthe processing height of the laser is controlled by recognizing a3D-shaped component part using a 3D recognition program and separatingthe component part into several levels for every height. Outer lineprocessing may be additionally performed to achieve plating uniformitybetween a non-processing surface and a plating surface formed byprocessing the metal junction face 22 using laser. The output value ofthe laser may be, for example, about 2 W to 30 W.

The metal junction face 22 processed by the laser has the metal core,the rough surface, and the trench, so that the conductive layer 40 canbe plated in a subsequent process.

FIG. 10 is a view illustrating that the conductive layer is provided inthe recess part. In the example shown in FIG. 10, the conductive layer40 has two stacked layers 41 and 42.

Referring to FIG. 10, the conductive layer 40 may be provided by platinga metal on the metal junction face 22 using an electroless process. Itwill be apparent that another plating process may be performed. Theconductive layer 40 may be copper, nickel, gold, silver, or acombination thereof. The conductive layer 40 may be a single-layered orstacked structure. In the stacked structure, layers may be the samemetal or different metals. In this embodiment, it is illustrated thatlayers of copper and nickel are sequentially stacked.

As an embodiment, a case where the first plating layer 41 made of copperis provided will be described in detail. The heat sink 120 providing themetal junction face 22 is immersed in an electroless copper platingsolution. In this case, the heat dissipation fin 130 and the air guidingpart 160 may be immersed together with the heat sink 120. For example,an aqueous plating solution for electroless copper may contain about 55ml to about 65 ml of a copper dry bathing/supplementing agent, about 55ml to about 65 ml of an alkaline supplementing agent, about 15 ml toabout 20 ml of a complexing agent, about 0.1 ml to about 0.2 ml of astabilizing agent, and about 8 ml to about 10 ml of formaldehyde, basedon deionized water.

The copper dry bathing/supplementing agent may contain, for example,about 6 parts by weight to about 12 parts by weight of copper sulfate,about 1 part by weight to about 1.5 parts by weight of polyethyleneglycol, about 0.01 part by weight to about 0.02 part of weight of thestabilizing agent, and about 78 parts by weight to about 80 parts byweight of water.

The alkaline supplementing agent may contain, for example, about 40parts by weight to about 50 parts by weight of sodium hydroxide, about0.01 part by weight to about 0.02 part by weight of the stabilizingagent, and about 50 parts by weight to about 60 parts by weight of thewater.

The complexing agent may contain, for example, about 49 parts by weightto about 50 parts by weight of the sodium hydroxide, about 0.01 part byweight to about 0.02 part by weight of the stabilizing agent, and about50 parts by weight to about 51 parts by weight of the water.

The stabilizing agent may contain, for example, about 0.2 part by weightto about 0.3 part by weight of potassium selenocyanate, about 5 parts byweight to about 6 parts by weight of potassium cyanide, about 0.3 partby weight to about 0.4 part by weight of the sodium hydroxide, and about92 parts by weight to about 93 parts by weight of the water.

For example, in order to provide the first plating layer 41 made ofcopper, a resin molded article provided with a catalyst may be immersedat a deposition speed of about 0.5 to about 0.7 μm/10 min in theelectroless copper solution at about 41° C. to about 55° C. and thenwashed by water.

The conductive layer 40 may be stacked up to a range exceeding the depthof the recess part 21. Accordingly, the resistance of the conductivelayer 40 can be reduced, and the heat conduction amount of theconductive layer 40 can be increased, thereby improving heat dissipationperformance. It will be apparent that the present disclosure is notlimited to the above-described configuration.

FIG. 11 is a view illustrating that the protective layer 60 is provided.

Referring to FIG. 11, the protective layer 60 may be applied on theconductive layer 40 and the insulating layer 20. Also, the protectivelayer 60 may be applied on the entire upper surface of the heat sink120. However, a light source region 200 (see FIG. 14) in which the lightsource 11 is mounted may be opened by etching the conductive layer 40,as shown in FIG. 11. The light source region 200 may be referred to as apartial region of the conductive layer 40, in which the light source 11is mounted.

In another aspect, the protective layer 60 may be provided on theconductive layer 40 except the partial region of the conductive layer40, in which the light source 11 is to be mounted. However, the presentdisclosure is not limited to the above-described configuration.

In this embodiment, it will be described that the protective layer 60 isapplied on the conductive layer 40 and the insulating layer 20 and thenetched such that the light source region 200 is opened.

The protective layer 60 may include an insulating material. For example,the protective layer 60 may include a solder resist, an epoxy material,a nano insulating coating material, a flexible composite insulatingmaterial, an organic material, an insulating permanent coating material,a polycarbonate material, a resin material, etc. However, in thisembodiment, it will be described that the protective layer 60 is asolder resist.

A process of stacking the protective layer 60 will be described. Theprotective layer 60 may be applied on the entire surface of theconductive layer 40 and the insulating layer 20.

A technique for applying the protective layer 60 may include a silkscreen printing technique, a photo solder resist (PSR) printingtechnique, etc. For example, the protective layer 60 may be applied byperforming a process of applying an IR ink corresponding to athermosetting resin composition and then heat-drying and curing the IRink. Also, the protective layer 60 may be applied by performing aprocess of applying a UV ink corresponding to an ultraviolet settingresin composition and then drying and curing the UV ink throughirradiation of ultraviolet light. Also, the protective layer 60 may beapplied by entirely applying a PSR ink and then performing processesincluding exposure, developing, UV drying (curing), and the like, inaddition to a process of heat-drying the ink.

After the protective layer 60 is applied, an etching process may beperformed to remove the protective layer 60 applied on the light sourceregion 200. For example, the etching process may be at least one of aplasma etching process, a wet etching process, and a reactive ionetching process. If the etching process is performed, the protectivelayer 60 may be provided such that the light source region 200 isopened.

FIG. 12 is a view illustrating that the bonding layer is provided.

Referring to FIG. 12, the bonding layer 50 may be provided in the lightsource region 200 (see FIG. 14). In other words, the bonding layer 50may be provided on the conductive layer 40 on which the light source 11is to be mounted. The bonding layer 50 may electrically connects thelight source 11 and the conductive layer 40 to each other.

The bonding layer 50 may be provided by applying a low-temperaturesolder paste on the conductive layer 40 on which the light source 11 isto be mounted, mounting the light source 11 at a position at which theelectrodes of the light source 11 are aligned on the low-temperaturesolder paste, and then allowing the low-temperature solder paste to passthrough a reflow machine. In the reflow process, an unnecessary portionis removed from the low-temperature solder paste, and a conductiveelement remains, so that the conductive layer 40 and the light source 11can be electrically connected to each other.

The low-temperature solder paste may include OM525 available at about160° C. Since a relatively low temperature atmosphere is formed in thereflow process, it is possible to prevent separation between theinsulating layer 20 and the heat sink 120 and separation between theconductive layer 40 and the insulating layer 20.

FIG. 13 is a view illustrating that the lens is further provided overthe light source.

Referring to FIG. 13, the lens 141 may be provided over the light source11. The lens 141 may shield the light source 11. Also, the lens 141 mayrefract and diffuse light generated from the light source 11. The lens141 may determine the diffusion angle of light generated from the lightsource 11 according to its shape. For example, the lens 141 may bemolded in a concave shape around the light source 11. Specifically, thelens 141 may include a material allowing light to be transmittedtherethrough. For example, the lens 141 may be formed of transparentsilicon, epoxy, or another resin material. In addition, the lens 141 maysurround the light source to protect the light source 11 from externalmoisture and impact and to isolate the light source 11 from the outside.

More specifically, for convenience of assembly, the lens 141 may bedisposed at the lens cover 142 formed corresponding to the insulatinglayer 20. Also, the lens 141 may be disposed at the lens cover 142formed corresponding to the protective layer 60 provided on theinsulating layer 20 or the conductive layer 40. The lens cover 142 maybe formed to correspond to the insulating layer 20 on the top surface ofthe insulating layer 20. The lens 141 positioned at the lens cover 142may be disposed at a position overlapping the light source 11. The lenscover 142 may be inserted in the mounting part 121 to waterproof thelight source 11 from the outside. Also, the lens cover 142 may befastened to the heat sink 120 through a fastening member to waterproofthe light source 11 from the outside.

FIG. 14 is a plan view of the light source module of FIG. 1, whichillustrates a state in which the lens cover is omitted. FIG. 15 is aplan view illustrating a state in which any protective layer is notprovided in the light source module of FIG. 14.

Referring to FIGS. 14 and 15, the mounting part 121 (see FIG. 6) onwhich the light source 11 is mounted may be formed on the top surface ofthe heat sink 120. The mounting part 121 may be provided by beingrecessed in the direction of bottom surface of the heat sink 120.

The mounting part 121 may be provided with the insulating layer 20having electrically insulating properties, the conductive layer 20provided in the recess part 21 (see FIG. 9) of the insulating layer 20,and the protective layer 60 protecting the insulating layer 20 and theconductive layer 40. In other words, the protective layer 60 may beprovided on the entire surface of the insulating layer 20 and theconductive layer 40, which are provided in the mounting part 121. Also,the protective layer 60 may be provided on only a portion of theconductive layer 40. However, the present disclosure is not limited tothe above-described configuration. In this embodiment, it will bedescribed that the protective layer 60 is provided on the conductivelayer 40 and the insulating layer 20.

The conductive layer 40 may include the light source region 200 in whichthe light source 11 is mounted and a connection region (see 220 of FIG.15) provided to supply electric current to the light source 11. Thelight source region 200 may be referred to as a region in which thelight source 11 is placed on the conductive layer 40.

The light source region 200 may be provided to face the light source 11.Specifically, the bottom surface of the light source 11 may include apositive electrode face 12 to which a positive electric current isapplied, a negative electrode face 13 to which a negative electriccurrent is applied, and a heat dissipation face 14 that transfers heatgenerated from the light source 11. The faces may be formed to be spacedapart from each other. Therefore, the light source region 200 mayinclude a first light source mounting part 201 facing the positiveelectrode face 12 and a second light source mounting part 202 facing thenegative electrode face 13. Also, the light source region 200 mayinclude a third light source mounting part 203 facing the heatdissipation face 14. The third light source mounting part 203 may not beprovided. However, the present disclosure is not limited to theabove-described configuration. In this embodiment, it will be describedthat the third light source mounting part 203 is provided.

The first light source mounting part 201 and the second light sourcemounting part 202 may apply electric current to the light source 11.Specifically, if a “positive electric current” is applied to the firstlight source mounting part 201, a “negative electric current” may beapplied to the second light source mounting part 202. The third lightsource mounting part 203 may transfer heat generated from the lightsource 11 to the heat sink 120.

The connection region 220 may connect different light sources 11 to eachother. Also, the connection region 220 may supply, to the light source11, power applied from a power source part (not shown). Therefore, theconnection region 220 may be provided as a straight conducting pathconnected to supply electric current to the light source 11. Inaddition, the connection region 220 may be provided in a patternrepeated in a certain shape, a curved line, a shape having differentthicknesses, or the like. However, the present disclosure is not limitedto the above-described configuration. In this embodiment, it will bedescribed that the connection region 220 is provided as a straightconducting path through which electric current is applied to the lightsource 11.

The protective layer 60 may be provided on the conductive layer 40 andthe insulating layer 20. However, the light source region 200 may beopened such that the light source 11 is mounted therein. The protectivelayer 60 may be provided on the insulating layer 20 and a portion of theconductive layer except the light source region 200. Also, theprotective layer 60 may be provided in only the connection region 220.However, the present disclosure is not limited to the above-describedconfiguration. In this embodiment, it will be described that theprotective layer 60 is provided on the conductive layer 40 and theinsulating layer 20, and the light source region 200 is opened such thatthe light source 11 is mounted therein.

The protective layer 60 may include an insulating material. For example,the protective layer 60 may include a silicon material, a solder resist,an epoxy material, a nano insulating coating material, a flexiblecomposite insulating material, an organic material, an insulatingpermanent coating material; a polycarbonate material, a resin material,etc. However, in this embodiment, it will be described that theprotective layer 60 is a solder resist.

The solder resist may include a permanent (petroleum) compound, an epoxyresin, a phenol-based hardener, and hardening accelerator.

The protective layer 60 may protect the conductive layer 40 from thebonding layer 50 (see FIG. 7). Specifically, the protective layer 60 maybe provided such that only the light source region 200 is opened.According to the above-described configuration, the protective layer 60can guide a region in which the bonding layer 50 may be melted and flowdown when the light source 11 and the conductive layer 40 are coupled toeach other. Thus, it is possible to prevent malfunction of the lightsource 11 as the bonding layer 50 flows down on the conductive layer 40.Further, it is possible to provide a neat external appearance.

The protective layer 60 can protect the conductive layer 40 from aforeign substance, a water drop, an insect, etc., penetrating from theoutside. Specifically, if high-temperature heat is generated from thelight source 11, thermal deformation of the conductive layer 40 orchemical reaction of a conductive material may be accelerated. Forexample, when the conductive layer 40 is made of copper, the copper isoxidized when it comes in contact with water or air. Therefore, thecopper may be corroded or discolored. When the conductive layer 40 ismade of nickel, a harmful material may be generated. In addition, theconductive layer 40 may cause a problem of corrosion or overload througha foreign substance or pollutant penetrating from the outside.Accordingly, if the protective layer 60 is provided on the conductivelayer 40, the conductive layer 40 can be protected, and thus it ispossible to prevent a problem caused by corrosion. Further, the lifespanof products can be increased by preventing overload. Moreover, it allowsfor a rapid fabrication processes, inexpensive fabrication cost,facilitation of mass production, and improvement of product yield.

The second embodiment is characterized in that any specific portion isdeformed in the first embodiment. Therefore, in the second embodiment,description of the first embodiment will be applied to portionsidentical to those of the first embodiment.

FIG. 16 is a plan view of a light source module according to a secondembodiment. FIG. 17 is a plan view illustrating a state in which anyprotective layer is not provided in the light source module of FIG. 16.

Referring to FIGS. 16 and 17, the insulating layer 20 havingelectrically insulating properties and the conductive layer 40 capableof supplying power to the light source 11 may be provided on the heatsink 120. That is, the mounting part 121 (see FIG. 6) is not provided inthe heat sink 120, and the insulating layer 20 and the conductive layer40 may be directly provided on the heat sink 120. However, the presentdisclosure is not limited to the above-described configuration.

The conductive layer 40 may be provided in the recess part 21 (FIG. 9)formed in the insulating layer 20. The conductive layer 40 may include alight source region 300 in which the light source 11 is mounted, aconnection region 320 through which power is applied to the light source11, and a heat dissipation region 350 formed to be spaced apart from theconnection region 320.

The heat dissipation region 350 may transfer heat generated from thelight source 11 to the heat sink 120. Also, the heat dissipation region350 may be provided such that the light source region 300 and theconnection region 320 are not electrically connected to each other.Also, the heat dissipation region 350 may be provided on the insulatinglayer 20 except regions in which the light source region 300 and theconnection region 320 are provided. However, the present disclosure isnot limited to the above-described configuration.

The heat dissipation region 350 may include an inner heat dissipationregion 351 provided inside the light source region 300 and theconnection region 320, and an outer heat dissipation region 352 providedoutside the light source region 300 and the connection region 320.

The light source region 300 may include a first light source mountingpart 301 applying a positive electric current to the light source 11, asecond light source mounting part 302 applying a negative electriccurrent to the light source 11, and a third light source mounting part303 transferring heat generated from the light source 11 to the heatsink 120.

The third light source mounting part 303 may be provided to be spacedapart from the first light source mounting part 301 and the second lightsource mounting part 302. In addition, the third light source mountingpart 303 may be connected to the heat dissipation region 350. In otherwords, the third light source mounting part 303 may be understood as abridge connecting the inner heat dissipation region 351 and the outerheat dissipation region 352 to each other. That is, the heat dissipationregion 350 may be provided as a single body.

According to the above-described configuration, the heat dissipationregion 350 can more efficiently transfer heat generated from the lightsource 11 to the heat sink 120.

The conductive layer 60 may be provided on the insulating layer 20 andthe conductive layer 40. However, the protective layer 60 may beprovided such that the light source region 300 having the light source11 mounted therein is opened. The protective layer may be provided ononly a portion of the conductive layer 40. However, the presentdisclosure is not limited to the above-described configuration. In thisembodiment, it will be described that the protective layer 60 isprovided on the insulating layer 20 and the conductive layer 40, andonly the light source region 300 is opened.

The protective layer 60 may include a reflective material. Specifically,the protective layer 60 may be disposed relatively downward of the lightsource 11. Thus, the protective layer 60 can serve as a reflective layerreflecting light emitted from the light source 11. For example, thereflective material may include a white or silver material, a reflectivesilicon material, a silicon white reflector material, a silicon whitereflective material, etc. The reflective material may be provided as amaterial that has high heat-proof characteristic and high opticalstability.

According to the above-described configuration, the protective layer 60can have excellent reflectivity with respect to light emitted from thelight source 11. That is, it is possible to obtain high opticalefficiency through the protective layer 60.

Meanwhile, the protective layer 60 may become a medium on whichcharacters 400 can be printed. Specifically, the characters 400 can beeasily provided to the light source module 100 through an etchingprocess the top surface of the protective layer 60 or a printing processof applying an inert ink on the top surface of the protective layer 60.That is, the protective layer 60 becomes the medium capable of providingthe characters 400, so that it is possible to prevent damage of theinsulating layer 20 or the conductive layer 40.

FIG. 18 is a perspective view of a lighting device including lightsource modules according to an embodiment.

Referring to FIG. 18, the lighting device 1000 according to theembodiment may include a main body 1100 providing a space in whichlighting modules 100 are coupled thereto, the main body 1100 forming anexternal appearance, and a connection part 1200 having a built-in powersource (not shown) coupled to one side of the main body 1100 to supplypower, the connection part 1200 connecting the main body 1100 to asupporting part (not shown). The lighting device 1000 according to theembodiment may be installed indoors or outdoors. For example, thelighting device 1000 according to the embodiment may be used as astreetlight. The main body 1100 may be provided with a plurality offrames 1110 capable of providing a space in which at least two lightsource modules 100 are positioned. The connection part 1200 has thepower source (not shown) built therein and connects the main body 1100to the supporting part (not shown) fixing the main body 1100 to theoutside.

If the lighting device 1000 according to the embodiment is used, heatgenerated from the light source modules 100 can be effectively cooleddue to a chimney effect. Further, a separate fan is not used, and thusfabrication cost can be reduced.

According to the present disclosure, due to effects such as rapidfabrication processes, inexpensive fabrication cost, facilitation ofmass production, and improvement of product yield, many advantages canbe expected in the production of lighting devices.

Particularly, products can be inexpensively fabricated at high speed.Thus, it is possible to promote the spread of lighting devices usinglight emitting diodes.

According to the present disclosure, the composition and disposition ofa conductive material applying electric current to light sources areoptimized, so that it is possible to reduce fabrication cost and toobtain stabilized operations. Thus, the present disclosure can be usedin various application fields including medical science, sterilization,spectral analysis, and the like, as well as lighting.

According to the present disclosure, a protective layer is provided in aconnection region through which electric current is supplied to thelight source, so that it is possible to protect a conductive layer froma foreign substance or water drop penetrating from the outside and toprevent the conductive layer from being oxidized due to contact withair.

Also, the protective layer includes a reflective material, so that lightemitted from the light source can be reflected from the protectivelayer, thereby improving the efficiency of the light source.

According to the present disclosure, a heat dissipation region isfurther provided to transfer heat generated from the light source to theheat sink, so that heat generated from the light source can be diffusedto the entire heat sink, thereby improving the heat dissipationefficiency of the light source module.

According to the present disclosure, an insulating layer is stacked onthe heat sink by a powder coating technique, a bottom surface recessedthrough a laser process is provided in the insulating layer, and aplating layer is provided on the recessed bottom surface. Thus, aprocess that has inexpensive fabrication cost and is suitable for massproduction can be performed without using any high-priced printedcircuit board and thermal pad. Accordingly, the light source module canbe rapidly fabricated.

Furthermore, it is possible to obtain various effects that can beunderstood through configurations described in the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light source module comprising: at least onelight source configured to emit light; a heat sink supporting the lightsource on a top surface thereof, the heat sink configured to absorb heatfrom the light source and dissipate the heat to the outside; anelectrically insulating layer applied to at least one surface of theheat sink; a conductive layer provided on the insulating layer, theconductive layer comprising: connection regions through which electriccurrent is supplied to the light source; and a light source regiondisposed between two of the connection regions, the light source regionhaving the light source mounted therein; and a protective layer appliedover the connection regions, wherein the conductive layer is provide ona metal junction face processed on the insulating layer, and wherein themetal junction face has at least one of a metal core, a rough surface,and a trench.
 2. The light source module according to claim 1, whereinthe light source region comprises a light source mounting part providinga positive electric current and negative electric current to the lightsource.
 3. The light source module according to claim 1, wherein theconductive layer further comprises a heat dissipation region fortransferring heat generated from the light source to the heat sink. 4.The light source module according to claim 3, wherein the heatdissipation region comprises: an inner heat dissipation region providedinside the light source region and the connection region; an outer heatdissipation region provided outside the light source region and theconnection region; and a bridge connecting the inner heat dissipationregion and the outer heat dissipation region to each other.
 5. The lightsource module according to claim 3, wherein the protective layer isapplied to the heat dissipation region.
 6. The light source moduleaccording to claim 1, wherein the protective layer is applied to theinsulating layer.
 7. The light source module according to claim 1,wherein the protective layer comprises a reflective material.
 8. Thelight source module according to claim 1, wherein the heat sink furthercomprises: a heat dissipation fin provided on a bottom surface of theheat sink, the heat dissipation fin dissipating heat to the outside; andan air hole passing through the heat sink.
 9. The light source moduleaccording to claim 1, wherein the conductive layer is provided in asingle layer made of a metal selected from the group consisting ofcopper and nickel.
 10. The light source module according to claim 1,wherein the conductive layer is provided by plating, in multiple layers,the same metal or different metals, selected from the group consistingof copper and nickel.
 11. The light source module according to claim 10,wherein copper is provided at a lower portion of the conductive layer,and nickel is provided at an upper portion of the conductive layer. 12.The light source module according to claim 1, wherein the protectivelayer is provided with a solder resist.
 13. A lighting device using thelight source module according to claim
 1. 14. A light source modulecomprising: at least one light source configured to emit light; a heatsink supporting the light source on a top surface thereof, the heat sinkconfigured to absorb heat from the light source and dissipate the heatto the outside; an electrically insulating part provided on at least onesurface of the heat sink; a conducting part provided on the insulatingpart, the conducting part having a light source region in which thelight source is placed; and a protecting part provided on the insulatingpart and the conducting part, wherein the protecting part is providedsuch that at least a portion of the light source region is exposed,wherein the conducting part is provide on a metal function faceprocessed on the insulating part, and wherein the metal junction facehas at least one of a metal core, a rough surface, and a trench.
 15. Thelight source module according to claim 14, wherein the light sourceregion comprises a light source mounting part providing a positiveelectric current and negative electric current to the light source. 16.The light source module according to claim 14, wherein the protectivelayer comprises a reflective material.
 17. The light source moduleaccording to claim 14, wherein the insulating part comprises anelectrically insulating layer applied to at least one surface of theheat sink, and wherein the conducting part comprises a conductive layerapplied to at least one portion of the insulating layer.
 18. A lightingdevice using the light source module according to claim
 14. 19. A methodfor fabricating a light source module, the method comprising: providinga light source; providing a heat sink to support the light source;applying an electrically insulating layer made of a resin material on atleast one surface of the heat sink; providing a recess part having ametal junction face in the insulating layer; providing a conductivelayer in the recess part; applying a protective layer on the conductivelayer; and bonding the light source to the conductive layer, wherein themetal junction face has at least one of a metal core, a rough surface,and a trench.
 20. The method according to claim 19, wherein theinsulating layer is applied on the entire surface of the heat sink.